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楊振偉

Overview

Works:	2 works in 1 publications in 1 languages

Titles

以相位移陰影雲紋法與有限元素分析探討IGBT功率模組受熱負載之力學行為 = = Investigation on the Mechanical Behavior of IGBT Power Module Subjected to Thermal Loading Using Phase-stepping Shadow Moire and Finite Element Analysis / by: 楊振偉 (Language materials, printed)

Subjects

direct bond copper. finite element analysis. insulate gate bipolar transistors. phase-stepping. power module. shadow moire. warpage. 功率模組. 有限元素分析. 直接銅接合. 相位移法. 絕緣柵雙極性電晶體. 翹曲. 陰影雲紋法.

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