Languages
Zhang, Qingke.
Overview
| Works: | 1 works in 1 publications in 1 languages | |
|---|---|---|
Titles
Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces
by:
Zhang, Qingke.; SpringerLink (Online service)
(Language materials, printed)
, [http://id.loc.gov/vocabulary/relators/aut]
Investigations on microstructure and mechanical properties of the Cu/Pb-free solder joint interfaces
by:
SpringerLink (Online service); Zhang, Qingke.
(Language materials, printed)
Subjects
Lead-free electronics manufacturing processes
Thin films.
Solid Mechanics.
Solder and soldering
Surfaces and Interfaces, Thin Films.
Materials—Surfaces.
Structural Mechanics.
Engineering.
Materials science.
Mechanics.
Mechanics, Applied.
Classical Mechanics.
Electronics
Characterization and Evaluation of Materials.