Elfadel, Ibrahim M.
Overview
| Works: | 2 works in 3 publications in 1 languages | |
|---|---|---|
Titles
3D stacked chips = from emerging processes to heterogeneous systems /
by:
Elfadel, Ibrahim M.; Fettweis, Gerhard.; SpringerLink (Online service)
(Language materials, printed)
VLSI-SoC 2023 = innovations for trustworthy artificial intelligence : 31st IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2023, Sharjah, United Arab Emirates, October 16-18, 2023 : revised extended selected papers /
by:
Workshop on the Preservation of Stability under Discretization ((2001 :); SpringerLink (Online service); Elfadel, Ibrahim M.; Albasha, Lutfi.
(Language materials, printed)
Tapered beams in MEMS = a symbolic modeling framework with applications to energy harvesting /
by:
SpringerLink (Online service); Elfadel, Ibrahim M.; Syed, Wajih U.
(Language materials, printed)
Subjects
Electronics and Microelectronics, Instrumentation.
Software Engineering.
Electronic Circuits and Devices.
Integrated circuits
Circuits and Systems.
Processor Architectures.
Microelectromechanical systems.
Electronic Circuits and Systems.
Energy Harvesting.
Three-dimensional integrated circuits.
Engineering.
Computer Engineering and Networks.
Computer Hardware.