Basavalingappa, Adarsh.
概要
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書目資訊
Modeling and Studying the Effect of Texture and Elastic Anisotropy of Copper Microstructure in Nanoscale Interconnects on Reliability in Integrated Circuits.
by:
ProQuest Information and Learning Co.; Basavalingappa, Adarsh.; State University of New York at Albany.
(書目-語言資料,手稿)