Languages
Seok, Seonho.
Overview
| Works: | 1 works in 1 publications in 1 languages | |
|---|---|---|
Titles
Advanced packaging and manufacturing technology based on adhesion engineering = wafer-level transfer packaging and fabrication techniques using interface energy control method /
by:
SpringerLink (Online service); Seok, Seonho.
(Language materials, printed)
Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering = Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method /
by:
Seok, Seonho.; SpringerLink (Online service)
(Language materials, printed)
, [http://id.loc.gov/vocabulary/relators/aut]
Subjects
Machinery.
Corrosion and anti-corrosives.
Nanotechnology and Microengineering.
Manufactures.
Tools.
Tribology, Corrosion and Coatings.
Coatings.
Manufacturing, Machines, Tools, Processes.
Manufacturing, Machines, Tools.
Manufacturing industries.
Engineering.
Materials science.
Nanotechnology.
Characterization and Evaluation of Materials.
Tribology.