Siow, Kim S.
Overview
| Works: | 0 works in 0 publications in 0 languages | |
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Titles
Die-Attach Materials for High Temperature Applications in Microelectronics Packaging = Materials, Processes, Equipment, and Reliability /
by:
Siow, Kim S.; SpringerLink (Online service)
(Language materials, printed)
, [http://id.loc.gov/vocabulary/relators/edt]
Subjects
Electronics and Microelectronics, Instrumentation.
Microelectronics.
Optical materials.
Reliability.
Optical and Electronic Materials.
Materials Engineering.
Quality control.
Electronics.
Materials science.
Industrial safety.
Quality Control, Reliability, Safety and Risk.
Electronic materials.
Metals.
Metallic Materials.
Characterization and Evaluation of Materials.
Engineering—Materials.