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Fan, X. J.
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Works:
0 works in 1 publications in 1 languages
Titles
Hybrid bonding, advanced substrates, failure mechanisms, and thermal management for chiplets and heterogeneous integration
by: SpringerLink (Online service); Fan, X. J.; Lau, John.
(Language materials, printed)
Subjects
Electronics and Microelectronics, Instrumentation.
Integrated circuits
Process Engineering.
Adhesives.
Printed circuits
Semiconductors.
Electronics Design and Verification.
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