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Lu, Daniel.

Overview

Works:	1 works in 1 publications in 1 languages

Titles

Materials for advanced packaging by: Wong, C.P.; Lu, Daniel.; SpringerLink (Online service) (Language materials, printed)

Materials for advanced packaging by: Lu, Daniel.; Wong, C.P.; SpringerLink (Online service) (Language materials, printed)

Subjects

Electronics and Microelectronics, Instrumentation. Nanotechnology and Microengineering. Packaging Circuits and Systems. Optical and Electronic Materials. Microelectronic packaging. Metallic Materials. Nanotechnology. Material Science. Engineering.

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