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      林育良
Overview
            | Works: | 3 works in 1 publications in 1 languages | |
|---|---|---|
Titles
          
                  
                    無鉛錫球封裝體之掉落應力及溫度循環疲勞分析 = = Numerical Studies of Lead-free solder Subjected to Drop Stress and Thermal Cycling Tests  /
                  
                  by: 
                  林育良
                  (Language materials, printed)