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吳家典
Overview
| Works: | 0 works in 1 publications in 1 languages | |
|---|---|---|
Titles
應用失效模式與效應分析於改善委外廠商IC封裝製程之品質 = = The Application of FMEA to Improve IC Packaging Quality of the Outsourcing Manufacturer /
by:
吳家典
(Language materials, printed)