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應用田口方法於真空濺鍍中獲取最佳鍍膜均勻性參數 = Applicatio...
Ruey-Shiang Guh

 

  • 應用田口方法於真空濺鍍中獲取最佳鍍膜均勻性參數 = Application of Taguchi Method in the Vacuum Sputtering System for the Best Film Thickness Uniformity Parameters
  • Record Type: Language materials, printed : monographic
    Paralel Title: Application of Taguchi Method in the Vacuum Sputtering System for the Best Film Thickness Uniformity Parameters
    Author: 洪志宗,
    Secondary Intellectual Responsibility: 顧瑞祥,
    Place of Publication: 雲林縣
    Published: 國立虎尾科技大學;
    Year of Publication: 民100[2011]
    Edition: 初版
    Description: 77面圖 : 30公分;
    Subject: 真空濺鍍
    Subject: 田口方法
    Subject: 均勻性
    Subject: Vacuum Sputtering
    Subject: Taguchi Method
    Subject: uniformity
    Online resource: http://cetd.lib.nfu.edu.tw/etdservice/view_metadata?etdun=U0028-1107201103061700
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T003222 圖書館B1F 博碩士論文專區 不流通(NON_CIR) 碩士論文(TM) TM 008.169M 3443 100 一般使用(Normal) On shelf 0
T003223 圖書館B1F 可外借論文區 不流通(NON_CIR) 一般圖書 008.169M 3443 100 一般使用(Normal) On shelf 0
  • 2 records • Pages 1 •
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