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A Survey on 3D Cameras: Metrological...

Giancola, Silvio.

A Survey on 3D Cameras: Metrological Comparison of Time-of-Flight, Structured-Light and Active Stereoscopy Technologies

Record Type:	Language materials, printed : Monograph/item
Title/Author:	A Survey on 3D Cameras: Metrological Comparison of Time-of-Flight, Structured-Light and Active Stereoscopy Technologies/ by Silvio Giancola, Matteo Valenti, Remo Sala.
Author:	Giancola, Silvio.
other author:	Valenti, Matteo.
Description:	IX, 90 p. 101 illus., 88 illus. in color.online resource. :
Contained By:	Springer Nature eBook
Subject:	Optical data processing. -
Online resource:	https://doi.org/10.1007/978-3-319-91761-0
ISBN:	9783319917610

A Survey on 3D Cameras: Metrological Comparison of Time-of-Flight, Structured-Light and Active Stereoscopy Technologies
Giancola, Silvio.

A Survey on 3D Cameras: Metrological Comparison of Time-of-Flight, Structured-Light and Active Stereoscopy Technologies[electronic resource] /by Silvio Giancola, Matteo Valenti, Remo Sala. - 1st ed. 2018. - IX, 90 p. 101 illus., 88 illus. in color.online resource. - SpringerBriefs in Computer Science,2191-5768. - SpringerBriefs in Computer Science,.

This book is a valuable resource to deeply understand the technology used in 3D cameras. In this book, the authors summarize and compare the specifications of the main 3D cameras available in the mass market. The authors present a deep metrological analysis of the main camera based on the three main technologies: Time-of-Flight, Structured-Light and Active Stereoscopy, and provide qualitative results for any user to understand the underlying technology within 3D camera, as well as practical guidance on how to get the most of them for a given application.

ISBN: 9783319917610

Standard No.: 10.1007/978-3-319-91761-0doiSubjects--Topical Terms:

639187
Optical data processing.

LC Class. No.: TA1630-1650

Dewey Class. No.: 006.6

A Survey on 3D Cameras: Metrological Comparison of Time-of-Flight, Structured-Light and Active Stereoscopy Technologies
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