Advances in embedded and fan-out waf...
Keser, Beth, (1971-)

 

  • Advances in embedded and fan-out wafer-level packaging technologies /
  • Record Type: Language materials, printed : Monograph/item
    Title/Author: Advances in embedded and fan-out wafer-level packaging technologies // edited by Beth Keser and Steffen Kröhnert.
    other author: Kröhnert, Steffen,
    Published: Hoboken, NJ, USA :Wiley, : 2019.,
    Description: xxvii, 548p. :ill. ; : 24cm. ;
    Subject: Integrated circuits - Wafer scale integration. -
    ISBN: 9781119314134 (cloth) :
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  • 1 records • Pages 1 •
 
E046105 圖書館3F 書庫 一般圖書(BOOK) 一般圖書 621.395 A2444 2019 一般使用(Normal) On shelf 0
  • 1 records • Pages 1 •
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