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Advances in embedded and fan-out waf...
~
Keser, Beth, (1971-)
Advances in embedded and fan-out wafer-level packaging technologies /
Record Type:
Language materials, printed : Monograph/item
Title/Author:
Advances in embedded and fan-out wafer-level packaging technologies // edited by Beth Keser and Steffen Kröhnert.
other author:
Kröhnert, Steffen,
Published:
Hoboken, NJ, USA :Wiley, : 2019.,
Description:
xxvii, 548p. :ill. ; : 24cm. ;
Subject:
Integrated circuits - Wafer scale integration. -
ISBN:
9781119314134 (cloth) :
Advances in embedded and fan-out wafer-level packaging technologies /
Advances in embedded and fan-out wafer-level packaging technologies /
edited by Beth Keser and Steffen Kröhnert. - Hoboken, NJ, USA :Wiley,2019. - xxvii, 548p. :ill. ;24cm.
Includes bibliographical references and index.
ISBN: 9781119314134 (cloth) :NT4429
LCCN: 2018034374Subjects--Topical Terms:
1222003
Integrated circuits
--Wafer scale integration.
LC Class. No.: TK7870.17 / .A38 2019
Dewey Class. No.: 621.39/5
Advances in embedded and fan-out wafer-level packaging technologies /
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9781119313977 (adobe PDF)
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9781119313984 (ePub)
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edited by Beth Keser and Steffen Kröhnert.
260
#
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Hoboken, NJ, USA :
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Wiley,
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2019.
300
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xxvii, 548p. :
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ill. ;
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24cm.
504
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Includes bibliographical references and index.
650
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Integrated circuits
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Wafer scale integration.
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1222003
650
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Kröhnert, Steffen,
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1970-
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editor.
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1222002
700
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Keser, Beth,
$d
1971-
$e
editor.
$3
1222001
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