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Titles
Subjects
Microelectronic packaging - Materials - Thermal properties.
Overview
Works:
1 works in 1 publications in 1 languages
Titles
Advanced thermal management materials
by:
(Language materials, printed)
Subjects
Microelectronics
Electronics and Microelectronics, Instrumentation.
Microelectronic packaging
Energy.
Energy Efficiency (incl. Buildings)
Engineering Thermodynamics, Heat and Mass Transfer.
Metallic Materials.
Heat sinks (Electronics)
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