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概要
書目資訊
主題
Microelectronics - Packaging.
概要
作品:
2 作品在 2 項出版品 2 種語言
書目資訊
3D microelectronic packaging : = from fundamentals to applications /
by:
(書目-語言資料,印刷品)
3D microelectronic packaging = from fundamentals to applications /
by:
(書目-語言資料,印刷品)
主題
Electronics and Microelectronics, Instrumentation.
Nanotechnology and Microengineering.
Electronic Circuits and Devices.
Optical and Electronic Materials.
Engineering.
Microengineering.
Microelectronics
Metallic Materials.
處理中
...
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