Warpage.
Overview
| Works: | 3 works in 2 publications in 2 languages | |
|---|---|---|
Titles
應用田口方法改善Chip on Wafer 製程之薄晶片翹曲研究 = = Using Taguchi Method to Improve Thin Wafer Warpage in the Chip on Wafer Process /
by:
(Language materials, printed)
電子封裝界面結合強度量測與脫層損傷分析 = = Electronic Packaging Interfacial Strength Measurement and Delamination Investigation /
by:
(Language materials, printed)
多曲面疊層複合材料零件成形回彈之模具補償研究 = = Study on Mold Compensation for Springback in Forming Multi-curved Laminated Composite Parts /
by:
(Language materials, printed)
Subjects