Warpage.

應用田口方法改善Chip on Wafer 製程之薄晶片翹曲研究 = = Using Taguchi Method to Improve Thin Wafer Warpage in the Chip on Wafer Process / by: (書目-語言資料,印刷品)

電子封裝界面結合強度量測與脫層損傷分析 = = Electronic Packaging Interfacial Strength Measurement and Delamination Investigation / by: (書目-語言資料,印刷品)

多曲面疊層複合材料零件成形回彈之模具補償研究 = = Study on Mold Compensation for Springback in Forming Multi-curved Laminated Composite Parts / by: (書目-語言資料,印刷品)

Taguchi Method..

Chip on Wafer.

Crack Propagation.

Springback compensation.

Strain Energy Release Rate.

Thin wafer.

應變能量釋放率.

裂紋擴展.

Warpage.

雙懸臂樑.

有限元素法.

Delamination.

Composite.

翹曲.

Response Surface Methodology.

Double Cantilever Beam.

反應曲面法.

Final Element Method.

回彈補償.

複合材料.

薄晶片.

田口方法.

脫層.