Double Cantilever Beam.

電子封裝界面結合強度量測與脫層損傷分析 = = Electronic Packaging Interfacial Strength Measurement and Delamination Investigation / by: (書目-語言資料,印刷品)

電子封裝界面強度量測與濕-熱耦合脫層損傷分析 = = Electronic Packaging Interface Strength Measurement and Hygro-thermal Coupling Delamination Investigation / by: (書目-語言資料,印刷品)

先進扇出型封裝之再分布層界面強度量測與濕-熱耦合脫層損傷分析 = = Advanced Fan-Out Packaging Interface Strength Measurement and Hygro-thermal Coupling Delamination Investigation / by: (書目-語言資料,印刷品)

Crack Propagation.

濕熱耦合.

Strain Energy Release Rate.

應變能量釋放率.

裂紋擴展.

濕-熱耦合.

Warpage.

雙懸臂樑.

Fan-Out.

Delamination.

界面強度.

Response Surface Methodology.

Double Cantilever Beam.

翹曲.

反應曲面法.

應變能釋放率.

Virtual crack closure technique method.

虛擬裂紋閉合技術.

脫層.

扇出型封裝.

Hygro-thermal Coupling.

Interface Strength.