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Overview
Titles
Subjects
表面黏著技術.
Overview
Works:
2 works in 2 publications in 2 languages
Titles
應用FMEA於SMT製程設計之研究 = = Applying FMEA for Design of SMT Process /
by:
(Language materials, printed)
失效模式與效應分析之應用-以個案公司記憶體模組生產流程中之表面黏著技術製程為例 = = The Application of The Failure Mode and Effect Analysis - A Study of the SMT Process of the DRAM Manufacturing Process for the Case Company /
by:
(Language materials, printed)
Subjects
Failure Mode and Effects Analysis.
memory modules.
Surface Mount Technology.
失效模式與效應分析.
surface mount technology.
failure mode and effects analysis.
Risk Priority Number.
記憶體模組.
表面黏著技術.
風險優先係數.
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