共晶鍵合.

探討鋁/氮化鋁多層應力緩衝底層對金錫共晶接合之影響 = = Effect of the AuSn Eutectic Bonding Joint by Studying the Underneath Al/AlN Multiple Strain Release Layers / by: (Language materials, printed)

AuSn Alloy.

Eutectic Bonding.

Al/AlN.

鋁/氮化鋁.

剪力.

共晶鍵合.

金錫合金.

shear stress.

覆晶封裝.

Flip Chip Package.