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Chiang, Kai-Chieh,

概要

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書目資訊

Simulations of Microelectronic Packaging Reliability by: Chiang, Kai-Chieh,; Purdue University. (書目-語言資料,印刷品)

主題

Boundary conditions. Cooling. Copper. Corrosion. Cracks. Deformation. Failure analysis. Geometry. Grain boundaries. Humidity. Integrated circuits. Interconnect. Intermetallic compounds. Mechanical engineering. Packaging. Scanning electron microscopy. Thermal cycling. Wire.

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