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Simulations of Microelectronic Packaging Reliability

Record Type:	Language materials, printed : Monograph/item
Title/Author:	Simulations of Microelectronic Packaging Reliability/ Kai-Chieh Chiang.
Author:	Chiang, Kai-Chieh,
Description:	1 electronic resource (97 pages)
Notes:	Source: Dissertations Abstracts International, Volume: 86-08, Section: B.
Contained By:	Dissertations Abstracts International86-08B.
Subject:	Mechanical engineering. -
Online resource:	http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=31850787
ISBN:	9798304950244

Simulations of Microelectronic Packaging Reliability
Chiang, Kai-Chieh,

Simulations of Microelectronic Packaging Reliability [electronic resource] /Kai-Chieh Chiang. - 1 electronic resource (97 pages)

Source: Dissertations Abstracts International, Volume: 86-08, Section: B.

Microelectronic packaging plays a vital role in semiconductor devices. With Moore's Law nearing its limits, packaging is gaining interest to overcome the challenge. Wire bonding and solder joints are two major interconnections in electronic packaging. They are both widely used based on the requirement of the packaging. Here provides mechanical models to understand the failure in both interconnections.Cu (copper) wire-bonding technology is attracting attention in the electronics industry due to its low cost and high electrical and mechanical properties. However, Cu wire bonding is known for its susceptibility to corrosion. The lifetime of Cu wires is shorter than its gold (Au) counterpart. To enhance the use of Cu wires in microelectronic packages, here presents a new mechano-chemical model that couples corrosion, mechanical response, and fracture. The model is used to understand the failure of Cu wires on Al pads in microelectronic packages using a multi-phase field approach. Under high humidity environments, the Cu- rich intermetallic compound (IMC), Cu9Al4, formed at the interface between Cu and Al, undergoes a corrosion degradation process. The IMC expands while undergoing corrosion-inducing interface stresses that nucleate and propagate cracks along the Cu-rich IMC/Cu. The model predicts failure due to corrosion and cracking. The model developed can be extended to other systems and applications.Sn (tin)-based solder joints are widely used to provide high-density interconnections in microelectronic packaging. However, under repetitive temperature cycling, Sn forms subgrains in high-strain regions, eventually leading to damage. Moreover, Sn's highly anisotropic material properties can contribute to the subgrain formation. A crystal plasticity model incorporating Sn's anisotropic and temperature-dependent properties is utilized to study the deformation and subgrain formation in Sn solder joints. Lattice rotations are calculated to show subgrain structure. The model developed here aims to predict the reliability of Sn solder joints subjected to temperature cycling.

English

ISBN: 9798304950244Subjects--Topical Terms:

557493
Mechanical engineering.
Subjects--Index Terms:

Microelectronic packaging

Simulations of Microelectronic Packaging Reliability
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520 # $a Microelectronic packaging plays a vital role in semiconductor devices. With Moore's Law nearing its limits, packaging is gaining interest to overcome the challenge. Wire bonding and solder joints are two major interconnections in electronic packaging. They are both widely used based on the requirement of the packaging. Here provides mechanical models to understand the failure in both interconnections.Cu (copper) wire-bonding technology is attracting attention in the electronics industry due to its low cost and high electrical and mechanical properties. However, Cu wire bonding is known for its susceptibility to corrosion. The lifetime of Cu wires is shorter than its gold (Au) counterpart. To enhance the use of Cu wires in microelectronic packages, here presents a new mechano-chemical model that couples corrosion, mechanical response, and fracture. The model is used to understand the failure of Cu wires on Al pads in microelectronic packages using a multi-phase field approach. Under high humidity environments, the Cu- rich intermetallic compound (IMC), Cu9Al4, formed at the interface between Cu and Al, undergoes a corrosion degradation process. The IMC expands while undergoing corrosion-inducing interface stresses that nucleate and propagate cracks along the Cu-rich IMC/Cu. The model predicts failure due to corrosion and cracking. The model developed can be extended to other systems and applications.Sn (tin)-based solder joints are widely used to provide high-density interconnections in microelectronic packaging. However, under repetitive temperature cycling, Sn forms subgrains in high-strain regions, eventually leading to damage. Moreover, Sn's highly anisotropic material properties can contribute to the subgrain formation. A crystal plasticity model incorporating Sn's anisotropic and temperature-dependent properties is utilized to study the deformation and subgrain formation in Sn solder joints. Lattice rotations are calculated to show subgrain structure. The model developed here aims to predict the reliability of Sn solder joints subjected to temperature cycling.
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650 # 4 $a Mechanical engineering. $3 557493
650 # 4 $a Corrosion. $3 995076
650 # 4 $a Scanning electron microscopy. $3 768680
650 # 4 $a Interconnect. $3 1503546
650 # 4 $a Geometry. $3 579899
650 # 4 $a Boundary conditions. $3 1372586
650 # 4 $a Packaging. $3 999828
650 # 4 $a Deformation. $3 1328788
650 # 4 $a Cracks. $3 1372560
650 # 4 $a Intermetallic compounds. $3 1503545
650 # 4 $a Copper. $3 792091
650 # 4 $a Wire. $3 1437735
650 # 4 $a Grain boundaries. $3 641589
650 # 4 $a Failure analysis. $3 1466254
650 # 4 $a Cooling. $3 812392
650 # 4 $a Humidity. $3 1168172
650 # 4 $a Thermal cycling. $3 1466217
650 # 4 $a Integrated circuits. $3 561474
653 # # $a Microelectronic packaging
653 # # $a Cu wires
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690 $a 0548
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