Languages
王朝成
Overview
Works: | 1 works in 1 publications in 1 languages |
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Titles
覆晶黏著封裝技術應用於高功率發光二極體之研究 = The flip chip and die-attached technique applied on the package of high power leds
by:
Chao Cheng Wang; Wen-Ray Chen; 陳文瑞; 王朝成
(Language materials, printed)
Subjects