Languages
林育良
Overview
Works: | 3 works in 1 publications in 1 languages |
---|
Titles
無鉛錫球封裝體之掉落應力及溫度循環疲勞分析 = = Numerical Studies of Lead-free solder Subjected to Drop Stress and Thermal Cycling Tests /
by:
林育良
(Language materials, printed)