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Advanced MEMS packaging

Record Type:	Language materials, printed : Monograph/item
Title/Author:	Advanced MEMS packaging/ John H. Lau ... [et al.].
remainder title:	Advanced microelectromechanical systems packaging.
other author:	Lau, John H.
Published:	New York :McGraw-Hill, : c2010.,
Description:	xxiii, 552 p. :ill. :
Subject:	Microelectromechanical systems. -
Online resource:	Click for full text (McGrawHill)
ISBN:	9780071626231

Advanced MEMS packaging
Advanced MEMS packaging[electronic resource] /Advanced microelectromechanical systems packaging.John H. Lau ... [et al.]. - New York :McGraw-Hill,c2010. - xxiii, 552 p. :ill.

Enabling technologies for advanced MEMS packaging -- Advanced MEMS wafer-level packaging -- Optical MEMS packaging : communications -- Optical MEMS packaging : bubble switch -- Optical MEMS : microbolometer packaging -- Bio-MEMS packaging -- Biosensor packaging -- Accelerometer packaging -- Radiofrequency MEMS switches -- RF MEMS tunable capacitors and tubable band-pass filters -- Advanced packaging of RF MEMS devices.

ISBN: 9780071626231

LCCN: 2009040456Subjects--Topical Terms:

559134
Microelectromechanical systems.
Index Terms--Genre/Form:

554714
Electronic books.

LC Class. No.: TK7875 / .A378 2010

Dewey Class. No.: 621.381/046

Advanced MEMS packaging
LDR:01196cam a2200241 i 4500 001 1118787
006 m d
007 cr nn muauu
008 240314s2010 nyua sb 001 0 eng
010 $a 2009040456
020 $a 9780071626231
020 $a 0071626239
020 $a 9789780071622
035 $a (OCoLC)ocn277205716
040 $a DLC $c DLC $d YDX $d BWX $d OKU $d DLC
041 0 $a eng
050 0 0 $a TK7875 $b .A378 2010
082 0 0 $a 621.381/046 $2 22
245 0 0 $a Advanced MEMS packaging $h [electronic resource] / $c John H. Lau ... [et al.].
246 3 $a Advanced microelectromechanical systems packaging.
260 $a New York : $b McGraw-Hill, $c c2010.
300 $a xxiii, 552 p. : $b ill.
505 0 $a Enabling technologies for advanced MEMS packaging -- Advanced MEMS wafer-level packaging -- Optical MEMS packaging : communications -- Optical MEMS packaging : bubble switch -- Optical MEMS : microbolometer packaging -- Bio-MEMS packaging -- Biosensor packaging -- Accelerometer packaging -- Radiofrequency MEMS switches -- RF MEMS tunable capacitors and tubable band-pass filters -- Advanced packaging of RF MEMS devices.
650 0 $a Microelectromechanical systems. $3 559134
650 0 $a Microelectronic packaging. $3 598419
655 7 $a Electronic books. $2 local $3 554714
700 1 $a Lau, John H. $3 791741
856 4 $u https://lb30.libraryandbook.net/Book_detial/EB978007162623101 $z Click for full text (McGrawHill)

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