| Record Type: |
Language materials, printed
: Monograph/item
|
| Title/Author: |
晶圓代工與先進封裝產業科技實務/ 曲建仲作 |
| Reminder of title: |
Wafer foundry and advanced package industry technology / |
| remainder title: |
Wafer foundry and advanced package industry technology |
| Author: |
曲建仲 |
| Published: |
新北市 :全華, : 2023, |
| Description: |
279面 :彩圖 : |
| Notes: |
含索引 |
| Subject: |
半導體 - |
| Online resource: |
udn讀書館 |
| ISBN: |
9786263284166 |