| Record Type: |
Language materials, printed
: Monograph/item
|
| Title/Author: |
晶圓代工與先進封裝產業科技實務/ 曲建仲作. |
| Reminder of title: |
Wafer foundry and advanced package industry technology / |
| remainder title: |
Wafer foundry and advanced package industry technology |
| Author: |
曲建仲. |
| Published: |
臺北市 :知識力科技 ; : 2024[民113]., |
| Description: |
279面 :彩圖, 表. : |
| Notes: |
資料型式: 文字 |
| Subject: |
半導體 - |
| Online resource: |
HyRead ebook電子書 |
| ISBN: |
9786263288171 |