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Force sensors for microelectronic pa...

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Brand, Oliver (1964-)

Force sensors for microelectronic packaging applications

紀錄類型:	書目-語言資料,印刷品 : 單行本
作者:	SchwizerJurg.,
合作者:	MayerM., 1971-
合作者:	BrandOliver, 1964-
出版地:	Berlin
出版者:	Springer;
出版年:	c2005.
面頁冊數:	viii, 178 p.ill. : 24 cm.;
集叢名:	Microtechnology and MEMS
標題:	Wire bonding (Electronic packaging) -
標題:	Microelectronic packaging. -
電子資源:	http://www.loc.gov/catdir/enhancements/fy0818/2004110615-d.html
電子資源:	http://www.loc.gov/catdir/toc/fy054/2004110615.html
附註:	Includes bibliographical references (p. [165]-174) and index.
ISBN:	9783540221876

Force sensors for microelectronic packaging applications
Schwizer, Jurg.

Force sensors for microelectronic packaging applications / J. Schwizer, M. Mayer, O. Brand. - Berlin : Springer, c2005.. - viii, 178 p. ; ill. ; 24 cm.. - (Microtechnology and MEMS).
Includes bibliographical references (p. [165]-174) and index..
ISBN 9783540221876ISBN 3540221875
Wire bonding (Electronic packaging)Microelectronic packaging.

Mayer, M.

Force sensors for microelectronic packaging applications
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215 1 $a viii, 178 p. $c ill. $d 24 cm.
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606 $a Microelectronic packaging. $3 527549 $2 lc $3 735645
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E028335

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621.381046 S415 2005

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