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高功率表面黏著型發光二極體封裝製程與特性量測 = The packing...

國立虎尾科技大學

高功率表面黏著型發光二極體封裝製程與特性量測 = The packing process and characterization of measurement for high power surface-mount light-emitting diode

Record Type:	Language materials, printed : monographic
Paralel Title:	The packing process and characterization of measurement for high power surface-mount light-emitting diode
Author:	游元慶,
Secondary Intellectual Responsibility:	閔庭輝,
Secondary Intellectual Responsibility:	陳文瑞,
Secondary Intellectual Responsibility:	國立虎尾科技大學
Place of Publication:	雲林縣
Published:	國立虎尾科技大學;
Year of Publication:	民97[2008]
Edition:	初版
Description:	32面圖,表 : 30公分;
Subject:	The packing process and characterization of meas
Subject:	封裝製程
Online resource:	http://140.130.12.251/ETD-db/ETD-search-c/view_etd?URN=etd-0123108-134914
Summary:	本研究利用高功率LED封裝製程，對於不同基板之封裝方式進行研究，從LED封裝製程中可充分瞭解各項製程參數對於LED之特性影響，進而分析各項封裝參數，有利於LED之封裝方式之最佳化。而LED封裝製程將從導線架清洗，利用固晶機將晶粒固定於導線架上，再利用打線機進行焊線動作，最後將環氧樹脂保護層封裝於外層，最後測試利用不同基板( sample A , B) 所封裝之LED，分別將LED封裝完成後，利用封裝完之二種不同之LED，在相同之工作環境條件下進行LED亮度及功率效率之量測。第一部分改變電流值由50mA到400mA，主要是觀察LED在兩種基板下之點亮溫度之差異性，第二部份，改變溫度量測來觀測不同溫度下之LED特性。 In this study, LED ( Light Emitting Diode ) packaging process was introduced; lead frame cleaning, die fixing, wire bonding. The SMD ( Surface Mount Device ) technology and two different kinds of LED packaging substrates ( sample A, B ) were used to accomplish the LED packaging process. The measurement was divided into two parts. First, the current value was changed from 50mA to 400mA. On another part, the working temperature was changed from 30℃ to 90℃. The performance of two types LED can be observed from the results of the measurement, the moderate voltage decline and better performance in sample B can be obtained

高功率表面黏著型發光二極體封裝製程與特性量測 = The packing process and characterization of measurement for high power surface-mount light-emitting diode
游, 元慶

高功率表面黏著型發光二極體封裝製程與特性量測 = The packing process and characterization of measurement for high power surface-mount light-emitting diode / 游元慶撰 - 初版. - 雲林縣 : 國立虎尾科技大學, 民97[2008]. - 32面 ; 圖,表 ; 30公分.
The packing process and characterization of meas封裝製程

閔, 庭輝

高功率表面黏著型發光二極體封裝製程與特性量測 = The packing process and characterization of measurement for high power surface-mount light-emitting diode
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330 $a 本研究利用高功率LED封裝製程，對於不同基板之封裝方式進行研究，從LED封裝製程中可充分瞭解各項製程參數對於LED之特性影響，進而分析各項封裝參數，有利於LED之封裝方式之最佳化。而LED封裝製程將從導線架清洗，利用固晶機將晶粒固定於導線架上，再利用打線機進行焊線動作，最後將環氧樹脂保護層封裝於外層，最後測試利用不同基板( sample A , B) 所封裝之LED，分別將LED封裝完成後，利用封裝完之二種不同之LED，在相同之工作環境條件下進行LED亮度及功率效率之量測。第一部分改變電流值由50mA到400mA，主要是觀察LED在兩種基板下之點亮溫度之差異性，第二部份，改變溫度量測來觀測不同溫度下之LED特性。 In this study, LED ( Light Emitting Diode ) packaging process was introduced; lead frame cleaning, die fixing, wire bonding. The SMD ( Surface Mount Device ) technology and two different kinds of LED packaging substrates ( sample A, B ) were used to accomplish the LED packaging process. The measurement was divided into two parts. First, the current value was changed from 50mA to 400mA. On another part, the working temperature was changed from 30℃ to 90℃. The performance of two types LED can be observed from the results of the measurement, the moderate voltage decline and better performance in sample B can be obtained
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