高功率發光二極體之覆晶圖案化矽副載具與鋁矽組合式副載具之開發 = The...
陳泰均

 

  • 高功率發光二極體之覆晶圖案化矽副載具與鋁矽組合式副載具之開發 = The development of the flip chip patterned silicon and the integrated silicon-aluminium submounts for high power LEDs
  • Record Type: Language materials, printed : monographic
    Paralel Title: The development of the flip chip patterned silicon and the integrated silicon-aluminium submounts for high power LEDs
    Author: 陳泰均,
    Secondary Intellectual Responsibility: 陳文瑞,
    Place of Publication: 雲林縣
    Published: 國立虎尾科技大學;
    Year of Publication: 民100[2011]
    Edition: 初版
    Description: 116面圖 : 30公分;
    Subject: 副載具
    Subject: 金錫合金
    Subject: 剪力強度
    Subject: Submount
    Subject: Au-Sn alloy
    Subject: Shear strength
    Online resource: http://cetd.lib.nfu.edu.tw/etdservice/view_metadata?etdun=U0028-0107201118255900
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T002880 圖書館B1F 博碩士論文專區 不流通(NON_CIR) 碩士論文(TM) TM 008.166M 7554 100 一般使用(Normal) On shelf 0
T002881 圖書館B1F 可外借論文區 不流通(NON_CIR) 一般圖書 008.166M 7554 100 一般使用(Normal) On shelf 0
  • 2 records • Pages 1 •
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