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Advanced MEMS packaging /

~

Lau, John H.

Advanced MEMS packaging /

Record Type:	Language materials, printed : Monograph/item
Title/Author:	Advanced MEMS packaging // John H. Lau ... [et al.].
remainder title:	Advanced microelectromechanical systems packaging
other author:	Lau, John H.
Published:	New York :McGraw-Hill, : c2010.,
Description:	xxiii, 552 p. :ill. ; : 24 cm.;
Subject:	Microelectronic packaging. -
ISBN:	9780071626231 (cloth) :

Advanced MEMS packaging /
Advanced MEMS packaging /Advanced microelectromechanical systems packagingJohn H. Lau ... [et al.]. - New York :McGraw-Hill,c2010. - xxiii, 552 p. :ill. ;24 cm.

Includes bibliographical references and index.

Enabling technologies for advanced MEMS packaging -- Advanced MEMS wafer-level packaging -- Optical MEMS packaging : communications -- Optical MEMS packaging : bubble switch -- Optical MEMS : microbolometer packaging -- Bio-MEMS packaging -- Biosensor packaging -- Accelerometer packaging -- Radiofrequency MEMS switches -- RF MEMS tunable capacitors and tubable band-pass filters -- Advanced packaging of RF MEMS devices.

ISBN: 9780071626231 (cloth) :NT4445

LCCN: 2009040456Subjects--Topical Terms:

598419
Microelectronic packaging.

LC Class. No.: TK7875 / .A378 2010

Dewey Class. No.: 621.381/046

Advanced MEMS packaging /
LDR:01137cam a2200229 a 4500 001 680179
005 20111104175511.0
008 111109s2010 nyua b 001 0 eng
010 $a 2009040456
020 $a 9780071626231 (cloth) : $c NT4445
020 $a 0071626239 (cloth)
035 $a (OCoLC)ocn277205716
035 $a 2009040456
040 $a DLC $c DLC $d YDX $d BWX $d OKU $d DLC
041 0 # $a eng
050 0 0 $a TK7875 $b .A378 2010
082 0 0 $a 621.381/046 $2 22
245 0 0 $a Advanced MEMS packaging / $c John H. Lau ... [et al.].
246 3 # $a Advanced microelectromechanical systems packaging
260 # $a New York : $c c2010. $b McGraw-Hill,
300 $a xxiii, 552 p. : $b ill. ; $c 24 cm.
504 $a Includes bibliographical references and index.
505 0 # $a Enabling technologies for advanced MEMS packaging -- Advanced MEMS wafer-level packaging -- Optical MEMS packaging : communications -- Optical MEMS packaging : bubble switch -- Optical MEMS : microbolometer packaging -- Bio-MEMS packaging -- Biosensor packaging -- Accelerometer packaging -- Radiofrequency MEMS switches -- RF MEMS tunable capacitors and tubable band-pass filters -- Advanced packaging of RF MEMS devices.
650 # 0 $a Microelectronic packaging. $3 598419
650 # 0 $a Microelectromechanical systems. $3 559134
700 1 # $a Lau, John H. $3 791741

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E035215

圖書館3F 書庫

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一般圖書

621.381046 A244 2010

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1 records • Pages 1 •
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