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應用鋁鍺共晶於發光二極體覆晶封裝之研究 = The Study of F...

Guan-Xiang Liao

應用鋁鍺共晶於發光二極體覆晶封裝之研究 = The Study of Flip Chip Packaging Technique on LEDs by Applying the Al-Ge Eutectic

Record Type:	Language materials, printed : monographic
Paralel Title:	The Study of Flip Chip Packaging Technique on LEDs by Applying the Al-Ge Eutectic
Author:	廖冠翔,
Secondary Intellectual Responsibility:	陳文瑞,
Place of Publication:	雲林縣
Published:	國立虎尾科技大學;
Year of Publication:	民101[2012]
Description:	87面圖 : 30公分;
Subject:	Al-Ge
Subject:	Flip-Chip
Subject:	接面溫度
Subject:	串聯電阻
Subject:	Al-Ge
Subject:	Flip-Chip
Subject:	junction temperature
Subject:	series resistance
Online resource:	http://cetd.lib.nfu.edu.tw/etdservice/view_metadata?etdun=U0028-1502201211273200

應用鋁鍺共晶於發光二極體覆晶封裝之研究 = The Study of Flip Chip Packaging Technique on LEDs by Applying the Al-Ge Eutectic
廖, 冠翔

應用鋁鍺共晶於發光二極體覆晶封裝之研究 = The Study of Flip Chip Packaging Technique on LEDs by Applying the Al-Ge Eutectic / 廖冠翔撰 - 雲林縣 : 國立虎尾科技大學, 民101[2012]. - 87面 ; 圖 ; 30公分.
含參考書目.
Al-GeFlip-Chip接面溫度串聯電阻Al-GeFlip-Chipjunction temperatureseries resistance

陳, 文瑞

應用鋁鍺共晶於發光二極體覆晶封裝之研究 = The Study of Flip Chip Packaging Technique on LEDs by Applying the Al-Ge Eutectic
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