LED用散熱封裝塗料之研究 = The Study on Heat-Di...
鄧維豐

 

  • LED用散熱封裝塗料之研究 = The Study on Heat-Dissipating Package Paints for Light-Emitting Diodes
  • Record Type: Language materials, printed : monographic
    Paralel Title: The Study on Heat-Dissipating Package Paints for Light-Emitting Diodes
    Author: 鄧維豐,
    Secondary Intellectual Responsibility: 莊賦祥,
    Place of Publication: 雲林縣
    Published: 國立虎尾科技大學;
    Year of Publication: 民101[2012]
    Description: 58面圖 : 30公分;
    Subject: 熱界面材料
    Subject: 散熱
    Subject: 熱傳導係數
    Subject: 塗料
    Subject: Thermal interface material
    Subject: Heat dissipation
    Subject: Thermal conductivity
    Subject: Paints
    Online resource: http://cetd.lib.nfu.edu.tw/etdservice/view_metadata?etdun=U0028-0302201211164900
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  • 2 records • Pages 1 •
 
T003456 圖書館B1F 博碩士論文專區 不流通(NON_CIR) 碩士論文(TM) TM 008.166M 1722 101 一般使用(Normal) On shelf 0
T003457 圖書館B1F 可外借論文區 不流通(NON_CIR) 一般圖書 008.166M 1722 101 一般使用(Normal) On shelf 0
  • 2 records • Pages 1 •
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