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高導電性錫球與膠材對WLCSP技術之最佳化設計 = Optimal De...
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  • 高導電性錫球與膠材對WLCSP技術之最佳化設計 = Optimal Design of a High Conductivity Solder Ball and Underfill Technology for Wafer Level Chip Scale Package
  • Record Type: Language materials, printed : monographic
    Paralel Title: Optimal Design of a High Conductivity Solder Ball and Underfill Technology for Wafer Level Chip Scale Package
    Author: 劉孟宗,
    Secondary Intellectual Responsibility: 莊為群,
    Place of Publication: 雲林縣
    Published: 國立虎尾科技大學;
    Year of Publication: 民101[2012]
    Description: 105面圖 : 30公分;
    Subject: 晶圓級尺度封裝
    Subject: 有限元素分析軟體
    Subject: 應力應變
    Subject: 整體翹曲
    Subject: 剪應力
    Subject: 應力緩衝層
    Subject: 楊氏係數
    Subject: 熱膨脹係數
    Subject: 實驗設計
    Subject: 覆晶
    Subject: 部份實驗因子
    Subject: 球狀陣列封裝技術
    Subject: 晶片尺度封裝技術
    Subject: 覆晶封裝技術
    Subject: 晶圓級尺度封裝技術。
    Subject: WLCSP
    Subject: Pro-E
    Subject: Finite Element Analysis
    Subject: Ansys
    Subject: Stress-Strain
    Subject: Overall Warpage
    Subject: Shear Force
    Subject: Stress Buffer Layer
    Subject: Young Modulus
    Subject: CTE
    Subject: DOE
    Subject: Compliant Layer
    Subject: Flip Chip
    Subject: Part of the Experimental Factor
    Subject: BGA
    Subject: CSP
    Subject: FC.
    Online resource: http://cetd.lib.nfu.edu.tw/etdservice/view_metadata?etdun=U0028-1701201201483400
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  • 2 records • Pages 1 •
 
T003440 圖書館B1F 博碩士論文專區 不流通(NON_CIR) 碩士論文(TM) TM 008.166M 7213 101 一般使用(Normal) On shelf 0
T003441 圖書館B1F 可外借論文區 不流通(NON_CIR) 一般圖書 008.166M 7213 101 一般使用(Normal) On shelf 0
  • 2 records • Pages 1 •
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