國立虎尾科技大學 |

Advanced electronic packaging

Record Type:	Language materials, printed : Monograph/item
Title/Author:	Advanced electronic packaging/
other author:	Ulrich, Richard K.
Published:	Hoboken, NJ :Wiley-Interscience/IEEE ; : c2006.,
Description:	1 online resource (xxvi, 812 p.) :ill. :
Notes:	Previous ed.: / William D. Brown. New York: IEEE, 1999.
Subject:	Microelectronic packaging. -
Online resource:	http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=5769522
ISBN:	9780471754503 (electronic bk.)

Advanced electronic packaging
Advanced electronic packaging[electronic resource]. - 2nd ed. / - Hoboken, NJ :Wiley-Interscience/IEEE ;c2006. - 1 online resource (xxvi, 812 p.) :ill. - IEEE Press series on microelectronic systems. - IEEE Press series on microelectronic systems..

Previous ed.: / William D. Brown. New York: IEEE, 1999.

Includes bibliographical references and index.

Acronyms -- Introduction and Overview of Microelectronic PackagingMaterials for Microelectronic Packaging -- Processing Technologies -- Organic Printed Circuit Board Materials and Processes -- Ceramic Substrates -- Electrical Considerations, Modeling, and Simulation -- Thermal Considerations -- Mechanical Design Considerations -- Discrete and Embedded Passive Devices -- Electronic Package Assembly -- Design Considerations -- Radio Frequency and Microwave Packaging -- Power Electronics Packaging -- Multichip and ThreeDimensional Packaging -- Packaging of MEMS and MOEMS: Challenges and a Case Study -- Reliability Considerations (PDF) -- Cost Evaluation and Analysis -- Analytical Techniques for Materials Characterization.

AnnotationAs in the First Edition, each chapter in this new Second Edition is authored by one or more acknowledged experts and then carefully edited to ensure a consistent level of quality and approach throughout. There are new chapters on passive devices, RF and microwave packaging, electronic package assembly, and cost evaluation and assembly, while organic and ceramic substrates are now covered in separate chapters. All the hallmarks of the First Edition, which became an industry standard and a popular graduatelevel textbook, have been retained.An Instructors Manual presenting detailed solutions to all the problems in the book is available upon request from the Wiley Makerting Department.

ISBN: 9780471754503 (electronic bk.)

Source: 9780471754503IEEEhttp://ieeexplore.ieee.orgSubjects--Topical Terms:

598419
Microelectronic packaging.
Index Terms--Genre/Form:

554714
Electronic books.

LC Class. No.: TK7874 / .A332 2006

Dewey Class. No.: 621.381046

Advanced electronic packaging
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020 $a 9780471466093 (hardback)
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250 $a 2nd ed. / $b edited by Richard K. Ulrich, William D. Brown.
260 $a Hoboken, NJ : $a [Chichester : $b Wiley-Interscience/IEEE ; $c c2006. $b John Wiley distributor],
300 $a 1 online resource (xxvi, 812 p.) : $b ill.
490 1 $a IEEE Press series on microelectronic systems
500 $a Previous ed.: / William D. Brown. New York: IEEE, 1999.
504 $a Includes bibliographical references and index.
505 0 $a Acronyms -- Introduction and Overview of Microelectronic PackagingMaterials for Microelectronic Packaging -- Processing Technologies -- Organic Printed Circuit Board Materials and Processes -- Ceramic Substrates -- Electrical Considerations, Modeling, and Simulation -- Thermal Considerations -- Mechanical Design Considerations -- Discrete and Embedded Passive Devices -- Electronic Package Assembly -- Design Considerations -- Radio Frequency and Microwave Packaging -- Power Electronics Packaging -- Multichip and ThreeDimensional Packaging -- Packaging of MEMS and MOEMS: Challenges and a Case Study -- Reliability Considerations (PDF) -- Cost Evaluation and Analysis -- Analytical Techniques for Materials Characterization.
520 8 $a Annotation $b As in the First Edition, each chapter in this new Second Edition is authored by one or more acknowledged experts and then carefully edited to ensure a consistent level of quality and approach throughout. There are new chapters on passive devices, RF and microwave packaging, electronic package assembly, and cost evaluation and assembly, while organic and ceramic substrates are now covered in separate chapters. All the hallmarks of the First Edition, which became an industry standard and a popular graduatelevel textbook, have been retained.An Instructors Manual presenting detailed solutions to all the problems in the book is available upon request from the Wiley Makerting Department.
588 $a Description based on print version record.
650 0 $a Microelectronic packaging. $3 598419
650 6 $a Mise sous bo�itier (Micro�electronique) $3 881153
650 6 $a Mise sous bo�itier (�Electronique) $3 881154
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700 1 $a Ulrich, Richard K. $q (Richard Kevin), $d 1955- $3 772520
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830 0 $a IEEE Press series on microelectronic systems. $3 771846
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