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Three-dimensional molded interconnec...

Franke, Jorg.

Three-dimensional molded interconnect devices (3D-MID) = materials, Manufacturing, assembly, and applications forinjection molded circuit carriers /

Record Type:	Language materials, printed : Monograph/item
Title/Author:	Three-dimensional molded interconnect devices (3D-MID)/ Jorg Franke.
Reminder of title:	materials, Manufacturing, assembly, and applications forinjection molded circuit carriers /
Author:	Franke, Jorg.
Published:	Munich ;Hanser, : 2014.,
Description:	xii, 356 p. :col. ill. ; : 25 cm.;
Subject:	Interconnects (Integrated circuit technology) - Design and construction. -
Online resource:	click for full text (2015 TAEBDC PDA eBooks Trial, Trial Period: 2015.6.3-2015.12.31)
ISBN:	9781569905517 (electronic bk.)

Three-dimensional molded interconnect devices (3D-MID) = materials, Manufacturing, assembly, and applications forinjection molded circuit carriers /
Franke, Jorg.

Three-dimensional molded interconnect devices (3D-MID)materials, Manufacturing, assembly, and applications forinjection molded circuit carriers /[electronic resource] :Jorg Franke. - Munich ;Hanser,2014. - xii, 356 p. :col. ill. ;25 cm.

Includes bibliographical references and index.

ISBN: 9781569905517 (electronic bk.)Subjects--Topical Terms:

563356
Interconnects (Integrated circuit technology)
--Design and construction.

LC Class. No.: TK7874.53 / .F7713 2014

Dewey Class. No.: 621.3815

Three-dimensional molded interconnect devices (3D-MID) = materials, Manufacturing, assembly, and applications forinjection molded circuit carriers /
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020 $a 9781569905517 (electronic bk.)
020 $a 9781569905517
035 $a 15000973
040 $a DLC $b eng $c DLC $d YDX $d YDXCP $d BTCTA $d IPL $d OCLCO
041 1 $a eng $h ger
050 0 0 $a TK7874.53 $b .F7713 2014
082 0 0 $a 621.3815 $2 23
100 1 $a Franke, Jorg. $3 1029014
240 1 0 $a Raumliche elektronische Baugruppen (3D-MID). $l English
245 1 0 $a Three-dimensional molded interconnect devices (3D-MID) $h [electronic resource] : $b materials, Manufacturing, assembly, and applications forinjection molded circuit carriers / $c Jorg Franke.
260 $a Munich ; $a Cincinnati, OH : $b Hanser, $c 2014.
300 $a xii, 356 p. : $b col. ill. ; $c 25 cm.
504 $a Includes bibliographical references and index.
650 0 $a Interconnects (Integrated circuit technology) $x Design and construction. $3 563356
650 0 $a Injection molding of plastics. $3 719730
856 4 0 $u http://www.sciencedirect.com/science/book/9781569905517 $z click for full text (2015 TAEBDC PDA eBooks Trial, Trial Period: 2015.6.3-2015.12.31)

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