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3D IC integration and packaging /

~

Lau, John H.

3D IC integration and packaging /

Record Type:	Language materials, printed : Monograph/item
Title/Author:	3D IC integration and packaging // John H. Lau.
Author:	Lau, John H.
Published:	New York :McGraw-Hill Education, : c2016.,
Description:	xxii, 458 p. :ill. ; : 24 cm.;
Subject:	Microelectronic packaging. -
ISBN:	9780071848060

3D IC integration and packaging /
Lau, John H.

3D IC integration and packaging /John H. Lau. - New York :McGraw-Hill Education,c2016. - xxii, 458 p. :ill. ;24 cm.

Includes bibliographical references and index.

ISBN: 9780071848060NT4602

LCCN: 2015013446Subjects--Topical Terms:

598419
Microelectronic packaging.

LC Class. No.: TK7874.893 / .L38 2015

Dewey Class. No.: 621.3815 / L36

3D IC integration and packaging /
LDR:00632cam a22002058a 4500 001 890592
005 20150417141322.0
008 180821s2016 nyu b 001 0 eng
010 $a 2015013446
020 $a 9780071848060 $q (hbk.) : $c NT4602
020 $a 0071848061 $q (hbk.)
020 $a 9780071848077 $q (pbk.)
035 $a 14570889
040 $a DLC $b eng $c DLC $d NTOU $d NFU $d NFU $e AACR2
042 $a nbic
050 0 0 $a TK7874.893 $b .L38 2015
082 0 $a 621.3815 $b L36
100 1 $a Lau, John H. $3 791741
245 1 0 $a 3D IC integration and packaging / $c John H. Lau.
260 $a New York : $b McGraw-Hill Education, $c c2016.
300 $a xxii, 458 p. : $b ill. ; $c 24 cm.
504 $a Includes bibliographical references and index.
650 0 $a Microelectronic packaging. $3 598419
650 0 $a Three-dimensional integrated circuits. $3 880880

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E045019

圖書館3F 書庫

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一般圖書

621.3815 L366 2016

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1 records • Pages 1 •
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