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MEMS packaging /

~

Cheng, Yu-Ting,

MEMS packaging /

Record Type:	Language materials, printed : Monograph/item
Title/Author:	MEMS packaging // editors, Y.C. Lee, Yu-Ting Cheng, Ramesh Ramadoss.
other author:	Cheng, Yu-Ting,
Published:	Hackensack, New Jersey :World Scientific, : c2018.,
Description:	xiv, 348 p. :ill. ; : 24 cm.;
Subject:	Microelectromechanical systems. -
ISBN:	9789813229358 (cloth) :

MEMS packaging /
MEMS packaging (World Scientific (Firm))

MEMS packaging /editors, Y.C. Lee, Yu-Ting Cheng, Ramesh Ramadoss. - Hackensack, New Jersey :World Scientific,c2018. - xiv, 348 p. :ill. ;24 cm. - WSPC series in advanced integration and packaging,volume 52315-473X ;.

Includes bibliographical references and index.

ISBN: 9789813229358 (cloth) :NT4570

LCCN: 2017039802Subjects--Topical Terms:

559134
Microelectromechanical systems.

LC Class. No.: TK7875 / .M4575 2018

Dewey Class. No.: 621.381/046

MEMS packaging /
LDR:00684cam a2200205 a 450 001 901459
005 20180604130325.0
008 181220s2018 njua b 001 0 eng
010 $a 2017039802
020 $a 9789813229358 (cloth) : $c NT4570
035 $a 20229530
040 $a DLC $b eng $c NFU $d DLC
041 0 # $a eng
042 $a pcc
050 0 0 $a TK7875 $b .M4575 2018
082 0 0 $a 621.381/046 $2 23
130 0 $a MEMS packaging (World Scientific (Firm)) $3 1168234
245 1 0 $a MEMS packaging / $c editors, Y.C. Lee, Yu-Ting Cheng, Ramesh Ramadoss.
260 # $a Hackensack, New Jersey : $b World Scientific, $c c2018.
300 $a xiv, 348 p. : $b ill. ; $c 24 cm.
490 0 $a WSPC series in advanced integration and packaging, $x 2315-473X ; $v volume 5
504 $a Includes bibliographical references and index.
650 # 0 $a Microelectromechanical systems. $3 559134
650 # 0 $a Microelectronic packaging. $3 598419
700 1 # $a Cheng, Yu-Ting, $e editor. $3 1168235
700 1 # $a Lee, Yung-Cheng, $e editor. $3 1168236
700 1 # $a Ramadoss, Ramesh, $e editor. $3 1168237

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1 records • Pages 1 •
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Inventory Number

No. of reservations

E045708

圖書館3F 書庫

一般圖書(BOOK)

一般圖書

621.381046 M533 2018

一般使用(Normal)

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1 records • Pages 1 •
1

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