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More than Moore Technologies for Nex...
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More than Moore Technologies for Next Generation Computer Design
Record Type:
Language materials, printed : Monograph/item
Title/Author:
More than Moore Technologies for Next Generation Computer Design/ edited by Rasit O. Topaloglu.
other author:
Topaloglu, Rasit O.
Description:
IX, 218 p. 116 illus., 63 illus. in color.online resource. :
Contained By:
Springer Nature eBook
Subject:
Electronic circuits. -
Online resource:
https://doi.org/10.1007/978-1-4939-2163-8
ISBN:
9781493921638
More than Moore Technologies for Next Generation Computer Design
More than Moore Technologies for Next Generation Computer Design
[electronic resource] /edited by Rasit O. Topaloglu. - 1st ed. 2015. - IX, 218 p. 116 illus., 63 illus. in color.online resource.
Impact of TSV and Device Scaling on the Quality of 3D Ics -- 3D Integration Technology -- Design and Optimization of Spin-Transfer Torque MRAMs -- Embedded STT-MRAM: Device and Design -- A Thermal and Process Variation Aware MTJ Switching Model and Its Applications in Soft Error Analysis -- Nano-Photonic Networks-on-Chip for Future Chip Multiprocessors -- Design Automation for On-chip Nanophotonic Integration.
This book provides a comprehensive overview of key technologies being used to address challenges raised by continued device scaling and the extending gap between memory and central processing unit performance. Authors discuss in detail what are known commonly as “More than Moore” (MtM), technologies, which add value to devices by incorporating functionalities that do not necessarily scale according to “Moore's Law”. Coverage focuses on three key technologies needed for efficient power management and cost per performance: novel memories, 3D integration and photonic on-chip interconnect.
ISBN: 9781493921638
Standard No.: 10.1007/978-1-4939-2163-8doiSubjects--Topical Terms:
563332
Electronic circuits.
LC Class. No.: TK7888.4
Dewey Class. No.: 621.3815
More than Moore Technologies for Next Generation Computer Design
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Impact of TSV and Device Scaling on the Quality of 3D Ics -- 3D Integration Technology -- Design and Optimization of Spin-Transfer Torque MRAMs -- Embedded STT-MRAM: Device and Design -- A Thermal and Process Variation Aware MTJ Switching Model and Its Applications in Soft Error Analysis -- Nano-Photonic Networks-on-Chip for Future Chip Multiprocessors -- Design Automation for On-chip Nanophotonic Integration.
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This book provides a comprehensive overview of key technologies being used to address challenges raised by continued device scaling and the extending gap between memory and central processing unit performance. Authors discuss in detail what are known commonly as “More than Moore” (MtM), technologies, which add value to devices by incorporating functionalities that do not necessarily scale according to “Moore's Law”. Coverage focuses on three key technologies needed for efficient power management and cost per performance: novel memories, 3D integration and photonic on-chip interconnect.
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