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雷射輔助結合.
Overview
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1 works in 1 publications in 1 languages
Titles
雷射輔助結合製程之覆晶封裝有限元素法與最佳化參數設計 = = Finite Element Method and Optimal Parameter Design for Laser-Assisted Bonding Process in Flip Chip Package /
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Subjects
Laser-assisted bonding.
Optimization design.
Warpage analysis.
最佳化設計.
翹曲分析.
雷射輔助結合.
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