熱蒸鍍.
概要
作品: | 15 作品在 13 項出版品 13 種語言 |
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書目資訊
以鋁鍺錫暫態液相鍵合應用於低溫覆晶封裝之研究 = = The Study of The Low Temperature Flip-Chip Package by Applying AlGeSn-Based Transient Liquid Phase Bonding Technique /
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(書目-語言資料,印刷品)
鋁鍺銅鋅錫合金應用於玻璃覆晶載板 = = Application of Al-Ge-Cu-Zn-Sn Flip-Chip Substrate for Glass /
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(書目-語言資料,印刷品)
鍺超薄膜的厚度與色度關係研究 = = Study on Chromaticity Related to Thickness of Germanium Ultra-thin Film /
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(書目-語言資料,印刷品)
應用鋁鍺錫暫態液相鍵結技術於晶片接合面之研究 = = Study of The Die-Attached Joint by Using AlGeSn TLP Bonded Technology /
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