Languages
Salah, Khaled.
Overview
| Works: | 1 works in 1 publications in 1 languages | |
|---|---|---|
Titles
Arbitrary Modeling of TSVs for 3D Integrated Circuits
by:
Salah, Khaled.; SpringerLink (Online service); El-Rouby, Alaa.; Ismail, Yehea.
(Language materials, printed)
, [http://id.loc.gov/vocabulary/relators/aut]
Trust Models for Next-Generation Blockchain Ecosystems
by:
Rehman, Muhammad Habib ur.; Damiani, Ernesto.; Svetinovic, Davor.; SpringerLink (Online service); Salah, Khaled.
(Language materials, printed)
, [http://id.loc.gov/vocabulary/relators/edt]
Arbitrary modeling of TSVs for 3D integrated circuits
by:
El-Rouby, Alaa.; Ismail, Yehea.; Salah, Khaled.; SpringerLink (Online service)
(Language materials, printed)
Subjects
Electronics and Microelectronics, Instrumentation.
Microelectronics.
Computer engineering.
Circuits and Systems.
Microprocessors.
Electrical engineering.
Communications Engineering, Networks.
Electronic circuits.
Electronics.
Three-dimensional integrated circuits
Information Systems and Communication Service.
Embedded computer systems.
Internet of things.
Cyber-physical systems, IoT.
Engineering.
Computers.
Processor Architectures.