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Qu, Shichun.

Overview

Works:	1 works in 1 publications in 1 languages

Titles

Wafer-level chip-scale packaging = analog and power semiconductor applications / by: Qu, Shichun.; SpringerLink (Online service); Liu, Yong. (Language materials, printed)

Wafer-Level Chip-Scale Packaging = Analog and Power Semiconductor Applications / by: Liu, Yong.; SpringerLink (Online service); Qu, Shichun. (Language materials, printed) , [http://id.loc.gov/vocabulary/relators/aut]

Subjects

Electronics and Microelectronics, Instrumentation. Microelectronics. Heat transfer. Thermodynamics. Circuits and Systems. Engineering. Mass transfer. Electronics. Electronic circuits. Engineering Thermodynamics, Heat and Mass Transfer. Chip scale packaging. Heat engineering.

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