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Qu, Shichun.

概要

作品:	1 作品在 1 項出版品 1 種語言

書目資訊

Wafer-level chip-scale packaging = analog and power semiconductor applications / by: Qu, Shichun.; SpringerLink (Online service); Liu, Yong. (書目-語言資料,印刷品)

Wafer-Level Chip-Scale Packaging = Analog and Power Semiconductor Applications / by: Liu, Yong.; SpringerLink (Online service); Qu, Shichun. (書目-語言資料,印刷品) , [http://id.loc.gov/vocabulary/relators/aut]

主題

Electronics and Microelectronics, Instrumentation. Microelectronics. Heat transfer. Thermodynamics. Circuits and Systems. Engineering. Mass transfer. Electronics. Electronic circuits. Engineering Thermodynamics, Heat and Mass Transfer. Chip scale packaging. Heat engineering.

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