Lin, Ta-Hsuan.
概要
| 作品: | 1 作品在 0 項出版品 0 種語言 | |
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書目資訊
Assembly process development, reliability and numerical assessment of copper column flexible flip chip technology.
by:
Lin, Ta-Hsuan.; State University of New York at Binghamton.; ProQuest Information and Learning Co.
(書目-語言資料,手稿)