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Assembly process development, reliability and numerical assessment of copper column flexible flip chip technology.

紀錄類型:	書目-語言資料,手稿 : Monograph/item
正題名/作者:	Assembly process development, reliability and numerical assessment of copper column flexible flip chip technology./
作者:	Lin, Ta-Hsuan.
面頁冊數:	1 online resource (212 pages)
附註:	Source: Dissertation Abstracts International, Volume: 69-07, Section: B, page: 4382.
Contained By:	Dissertation Abstracts International69-07B.
標題:	Mechanical engineering. -
電子資源:	click for full text (PQDT)
ISBN:	9780549762669

Assembly process development, reliability and numerical assessment of copper column flexible flip chip technology.
Lin, Ta-Hsuan.

Assembly process development, reliability and numerical assessment of copper column flexible flip chip technology. - 1 online resource (212 pages)

Source: Dissertation Abstracts International, Volume: 69-07, Section: B, page: 4382.

Thesis (Ph.D.)--State University of New York at Binghamton, 2008.

Includes bibliographical references

Flexible Flip Chip Connection (F2C2) technology was proposed utilizing copper columns instead of solder balls as the electrical and mechanical interconnection between the semiconductor chip and the substrate. The most significant benefit of F2C2 technology is the increased standoff height and flexible copper columns that accommodate the CTE mismatch between chip and substrate. Hence, the strain within the joints is reduced and the need for underfill for fatigue life enhancement is eliminated.

Electronic reproduction.
Ann Arbor, Mich. :
ProQuest,
2018

Mode of access: World Wide Web

ISBN: 9780549762669Subjects--Topical Terms:

557493
Mechanical engineering.
Index Terms--Genre/Form:

554714
Electronic books.

Assembly process development, reliability and numerical assessment of copper column flexible flip chip technology.
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245 1 0 $a Assembly process development, reliability and numerical assessment of copper column flexible flip chip technology.
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300 $a 1 online resource (212 pages)
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500 $a Source: Dissertation Abstracts International, Volume: 69-07, Section: B, page: 4382.
500 $a Adviser: Susan Lu.
502 $a Thesis (Ph.D.)--State University of New York at Binghamton, 2008.
504 $a Includes bibliographical references
520 $a Flexible Flip Chip Connection (F2C2) technology was proposed utilizing copper columns instead of solder balls as the electrical and mechanical interconnection between the semiconductor chip and the substrate. The most significant benefit of F2C2 technology is the increased standoff height and flexible copper columns that accommodate the CTE mismatch between chip and substrate. Hence, the strain within the joints is reduced and the need for underfill for fatigue life enhancement is eliminated.
520 $a The primary objective of this research effort was to develop a process for attaching a silicon chip to a substrate using a matrix of flexible copper wires. The F2C2 process utilizes copper wires embedded in a wafer slice to interconnect the footprints of the chip and substrate. The wafer slice is composed of a heat resistant, dissolvable substance that encapsulates and maintains the wires in position. After chip-wafer-substrate attachment, the slice is dissolved away with water/solvent, leaving the flexible wires connecting the chip and substrate.
520 $a The secondary objective was to conduct initial reliability test and failure mechanism analysis. Accelerated Thermal Cycling (ATC) tests were conducted on F2C2 components as well as C4 and underfilled C4 components. The ATC test was conducted in an air-to-air thermal shock chamber. JEDEC standard, JESD22-A104C condition B, was applied with test condition --55 °C to 125 °C, 2 cycles per hour, with a failure criterion of 100 mO electrical pair resistance increase from time zero. The ATC test results were analyzed in regard to failure locations, failure mode, and characteristic life.
520 $a Another objective of this research is to use Finite Element Modeling (FEM) to study thermomechanical behavior and predict fatigue life. Nondestructive measurements were made using Digital Image Correlation to determine the warpage of the chip and the substrate for F2C2, C4 and underfilled C4 to compare their thermomechanical behaviors and for FEM model validation. FEM models were used to study the stress/strain distribution in the chip, substrate and interconnects. The FEM models were also used to predict the fatigue life and combined with Design of Experiments (DOE) method to study the effects of structural parameters with respect of fatigue life.
533 $a Electronic reproduction. $b Ann Arbor, Mich. : $c ProQuest, $d 2018
538 $a Mode of access: World Wide Web
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650 4 $a Industrial engineering. $3 679492
650 4 $a Systems science. $3 1148479
655 7 $a Electronic books. $2 local $3 554714
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710 2 $a ProQuest Information and Learning Co. $3 1178819
710 2 $a State University of New York at Binghamton. $b Systems Science. $3 1189523
773 0 $t Dissertation Abstracts International $g 69-07B.
856 4 0 $u http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=3324387 $z click for full text (PQDT)