Siow, Kim S.
Overview
| Works: | 0 works in 0 publications in 0 languages | |
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Titles
Die-Attach Materials for High Temperature Applications in Microelectronics Packaging = Materials, Processes, Equipment, and Reliability /
by:
Siow, Kim S.; SpringerLink (Online service)
(Language materials, printed)
, [http://id.loc.gov/vocabulary/relators/edt]
Subjects
Characterization and Evaluation of Materials.
Electronic materials.
Electronics.
Electronics and Microelectronics, Instrumentation.
Engineering—Materials.
Industrial safety.
Materials Engineering.
Materials science.
Metallic Materials.
Metals.
Microelectronics.
Optical and Electronic Materials.
Optical materials.
Quality control.
Quality Control, Reliability, Safety and Risk.
Reliability.