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林嗣唯

Overview

Works:	0 works in 1 publications in 1 languages

Titles

基於近似數值模擬之電子封裝銲點落摔可靠度與設計優化研究 = = Reliability and Design Optimization of Solder Joints in Electronic Packaging under Drop Impact Based on Approximate Numerical Simulation / by: 林嗣唯 (Language materials, printed)

Subjects

Approximate mode. Drop Test. Finite Element Method. Nodal Displacement-Driven Method. Optimization Analysis. Reliability Analysis. 優化分析. 可靠度分析. 有限元素法. 節點位移驅動. 落摔測試. 近似模型.

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