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基於近似數值模擬之電子封裝銲點落摔可靠度與設計優化研究 = = Reli...

林嗣唯

基於近似數值模擬之電子封裝銲點落摔可靠度與設計優化研究 = = Reliability and Design Optimization of Solder Joints in Electronic Packaging under Drop Impact Based on Approximate Numerical Simulation /

Record Type:	Language materials, printed : Monograph/item
Title/Author:	基於近似數值模擬之電子封裝銲點落摔可靠度與設計優化研究 =/ 林嗣唯.
Reminder of title:	Reliability and Design Optimization of Solder Joints in Electronic Packaging under Drop Impact Based on Approximate Numerical Simulation /
remainder title:	Reliability and Design Optimization of Solder Joints in Electronic Packaging under Drop Impact Based on Approximate Numerical Simulation.
Author:	林嗣唯
Published:	雲林縣 :國立虎尾科技大學 , : 民114.07.,
Description:	[11], 64面 :圖, 表 ; : 30公分.;
Notes:	指導教授: 吳瑋特, 施孟鎧.
Subject:	節點位移驅動. -
Online resource:	電子資源

基於近似數值模擬之電子封裝銲點落摔可靠度與設計優化研究 = = Reliability and Design Optimization of Solder Joints in Electronic Packaging under Drop Impact Based on Approximate Numerical Simulation /
林嗣唯

基於近似數值模擬之電子封裝銲點落摔可靠度與設計優化研究 =Reliability and Design Optimization of Solder Joints in Electronic Packaging under Drop Impact Based on Approximate Numerical Simulation /Reliability and Design Optimization of Solder Joints in Electronic Packaging under Drop Impact Based on Approximate Numerical Simulation.林嗣唯. - 初版. - 雲林縣 :國立虎尾科技大學 ,民114.07. - [11], 64面 :圖, 表 ;30公分.

指導教授: 吳瑋特, 施孟鎧.

碩士論文--國立虎尾科技大學機械與電腦輔助工程系碩士班.

含參考書目.

(平裝).Subjects--Topical Terms:

1494486
節點位移驅動.

基於近似數值模擬之電子封裝銲點落摔可靠度與設計優化研究 = = Reliability and Design Optimization of Solder Joints in Electronic Packaging under Drop Impact Based on Approximate Numerical Simulation /
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