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Gan, Chong Leong.

Overview

Works:	0 works in 1 publications in 1 languages

Titles

Electronic materials innovations and reliability in advanced memory packaging by: Huang, Chen-Yu.; SpringerLink (Online service); Gan, Chong Leong. (Language materials, printed)

Subjects

Electronic Circuits and Systems. Electronic Materials. Electronic packaging Electronics Design and Verification. Industrial and Production Engineering. Materials Engineering.

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